Chip Packing AOI Machine
The CesiStar Series is a series of high-speed and high-precision fully automatic visual inspection equipments that use optical principles to detect chip defects. It is widely used in the research, development, and manufacturing of semiconductors, consumer electronics, optics, and other fields. It can perform detective functions for v... moreChip Packing AOI Machine https://www.bozhontech.com/products/chip-packing-aoi-machine/ #automatic#optical#inspection#machine#price
Chip Packing AOI Machine
The CesiStar Series is a series of high-speed and high-precision fully automatic visual inspection equipments that use optical principles to detect chip defects. It is widely used in the research, development, and manufacturing of semiconductors, consumer electronics, optics, and other fields. It can perform detective functions for various types of chip packages such as BGA, LGA,QFN, and QFP to ensure the final packaging appearance quality and yield improvement.
Advantages of Chip Packing AOI Machine
high-speed and high-precision fully automatic visual inspection equipments
For various types of chip packages such as BGA, LGA,QFN, and QFP to ensure the final packaging appearance quality and yield improvement.
Last posted by neonphotonics on September 12 at 09:31 PM
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